HOW TO REDUCE PARASITIC CAPACITANCE IN PBC LAYOUT?

How To Reduce Parasitic Capacitance In PBC Layout?

How To Reduce Parasitic Capacitance In PBC Layout?

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In electronic system design, noise is a critical factor affecting performance, particularly in high-frequency systems where SD2918 and inductance are common sources of interference. While parasitic inductance is relatively easier to understand and diagnose, parasitic capacitance requires a deeper understanding, especially regarding how it is influenced by the PCB layout geometry.

This article explores the sources, effects, and reduction methods of parasitic capacitance, with a focus on high-frequency routing and examples from switching regulators.

The Basic Concept of Parasitic Capacitance


SD2918 refers to the unintended capacitance that exists between two conductive structures separated by an insulating material. While generally unwanted, SD2918 can be beneficial in certain cases. For example, a power-ground plane can provide a stable charge reserve, or a co-planar waveguide can leverage parasitic capacitance to set the interconnect impedance.

On a PCB, parasitic capacitance can occur between any pair of conductors, especially when they are separated by an insulating material. It can be categorized into two types:

Self-capacitance: This occurs between a single conductor and other conductors (usually ground), causing undesirable capacitance.

Mutual capacitance: This refers to the capacitance between two conductors, which are each referenced to a third conductive structure (e.g., ground), leading to capacitive coupling between the conductors.

The Impact of Parasitic Capacitance


The primary issue with parasitic capacitance is that it can induce signal crosstalk. When voltage changes occur, parasitic capacitance generates displacement current in the conductors, potentially degrading signal integrity. In high-frequency signal processing, parasitic capacitance is particularly significant, as it can lead to unwanted noise coupling. This becomes more problematic when high-frequency signals propagate through the PCB layout, potentially affecting nearby circuits and reducing overall system performance.

How to Reduce Parasitic Capacitance?


While it is nearly impossible to completely eliminate parasitic capacitance, its effects can be significantly minimized through optimal PCB layout design. Below are some strategies to reduce parasitic capacitance:



  1. Noise Isolation in High dV/dt Nodes


In applications like switching regulators, high dV/dt (voltage change rate) nodes are critical areas where parasitic capacitance can significantly impact performance. For example, the SW_OUT node in a switching regulator may generate high dV/dt noise that couples through parasitic capacitance to surrounding circuits. To reduce this noise coupling, placing a large capacitor between the SW_OUT node and ground provides a low-impedance path, effectively decoupling the switching noise.

Additionally, bringing the ground plane closer to the high dV/dt node reduces mutual capacitance, enhancing the coupling of the electric field with ground and effectively reducing parasitic capacitance.



  1. Reducing Mutual Capacitance Between Traces


Capacitive crosstalk between traces is a common issue in PCB design, particularly with high-frequency signal traces. To reduce parasitic capacitance between traces, increasing the spacing between signal lines helps reduce capacitive coupling and mitigate crosstalk.

Another effective method is routing signal lines close to the ground plane. This technique leverages mirrored charges and currents on the ground to reduce capacitance coupling between the signal lines. While the second method is more commonly used, the first method can also be effective, especially when impedance matching is maintained.

Conclusion


Parasitic capacitance is a significant issue in electronic system design, especially in high-frequency applications. While it is nearly impossible to fully eliminate parasitic capacitance, its impact can be minimized through optimal PCB layout strategies, such as proper trace routing and ground plane placement. By understanding and applying these methods, designers can improve system performance, reduce noise coupling, and ensure efficient, stable signal transmission.

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